Charging IC Faults
No Charge And USB Controller Failures Replaced On The Board.
BGA Reball
Reball And Chip Replacement Where Donor Parts Allow.
Trace Repair
Broken Rails Jumpered After Drops, Flex Damage Or Corrosion.
Pad Rebuilds
Torn Pads Rebuilt So Connectors And ICs Can Be Refitted.
Power Rails
Shorted Rails Isolated When The Device Draws Power And Dies.
Ultrasonic Cleaning
Liquid Residue Removed Before Component-Level Repair Starts.
1Book In
Send The Fault, Then Drop The Device In When Ready.
2Diagnose
We Isolate The Failed Part Before Any Repair Starts.
3Repair
Quality Parts, Full Test, Then Back In Your Hands.